The traditional thick film lines and spaces of 0.005" to 0.010" work well in many applications. Sometimes tighter line spacing is a necessity which can be resolved by using ETF (Etched Thick Film). CW Microtech offers partial or complete etching solutions. ETF can reduce line widths to 0.0013". In some RF and digital applications, etched thick film has proven a cost effective alternative to thin film circuits.

CW Microtech Offers:

• Etchable Thick Film (down to 1.3 mil lines and spaces)
• Fodel © Printing
• Edge Transition Technology (fine lines wraped around 90 degree edge of ceramic)
• Diffusion patterning to produce via resolutions down to 0.004"
• Solid thru metallized vias