CW Microtech has in-house laser cutting and substrate profiling facility that can be used to produce double-sided substrates via through-hole. These types of substrates not only offer significant space saving in terms of circuit size and density but also deliver superior technical performance. CW Microtech keeps standard thickness Alumina panels (96% Alumina, 99.6% Al2O3, etc) in stock. This allows us to make physical samples of complex designs the same day that we receive CAD data. CW Microtech also offers ceramic laser scribing on a stand alone basis for outside customers. Please see our Ceramic Cutting Design Guidelines for additional information.

	Alumina AlN Scribbing Slotting Vias